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2024

Roy, Sudipta and Andreou, Eleni (2024) Considerations for digitalisation of nickel electroforming. Transactions of the Institute of Metal Finishing, 102 (6). pp. 297-304. ISSN 0020-2967

Tambe, C. Enowmbi and Green, T.A. and Roy, S. (2024) The multifaceted role of boric acid in nickel electrodeposition and electroforming. Journal of the Electrochemical Society, 171 (10). 102503. ISSN 0013-4651

Andreou, Eleni and Roy, Sudipta (2024) Modelling and verification of the nickel electroforming process of a mechanical vane fit for Industry 4.0. Digital Chemical Engineering, 12. 100177. ISSN 2772-5081

2023

Green, T. A. and Roy, S. (2023) Influence of corrosion reactions on the pulse electrodeposition of metals and alloys. Journal of the Electrochemical Society, 170 (12). 122503. ISSN 0013-4651

2022

Moreno-Leon, Carlos and Mack, Corin and Roy, Sudipta and ter Horst, Joop H. (2022) Solubility analysis of 18 active pharmaceutical ingredients and intermediates in the non-polar solvents dioxane, toluene and cyclopentyl methyl ether. Journal of Molecular Liquids, 367 (Part A). 120365. ISSN 0167-7322

Green, Todd and Tambe, Christine Enowmbi and Roy, Sudipta (2022) Characteristics of anode materials for nickel electroforming. Journal of the Electrochemical Society, 169 (9). 092510. ISSN 0013-4651

Andreou, Eleni and Roy, Sudipta (2022) Modelling the scaling-up of the nickel electroforming process. Frontiers in Chemical Engineering, 4. 755725. ISSN 2673-2718

2021

Andreou, Eleni and Roy, Sudipta (2021) Modelling the electroforming process : significance and challenges. Transactions of the Institute of Metal Finishing, 99 (6). pp. 299-305. ISSN 0020-2967

Green, T.A. and Su, X. and Roy, S. (2021) Pulse electrodeposition of copper in the presence of a corrosion reaction. Journal of the Electrochemical Society, 168 (6). 062515. ISSN 0013-4651

2020

Debnath, Shaon and Roy, Sudipta and Chen, Yi-Chieh (2020) Development of fibre-optic pH sensor based on silver nanoparticle embedded in silica matrix for high temperature/pressure conditions. In: Butler meeting 2020, 2020-09-01 - 2020-09-01, Virtual Event.

Valverde, P. E. and Green, T. A. and Roy, S. (2020) Effect of water on the electrodeposition of copper from a deep eutectic solvent. Journal of Applied Electrochemistry, 50 (6). pp. 699-712. ISSN 0021-891X

Roy, Sudipta and Andreou, Eleni (2020) Electroforming in the Industry 4.0 era. Current Opinion in Electrochemistry, 20. pp. 108-115. ISSN 2451-9103

2019

Andreou, Eleni and Roy, Sudipta (2019) Electroforming of large scale nickel structures for leading edge energy, aerospace and marine applications. In: SRPe Inaugural Conference, 2019-11-13 - 2019-11-13, University of Strathclyde.

Zajkoska, S. Mrkonjić and Mann, R. and Hansal, W. and Roy, S. and Kautek, W. (2019) Electrodeposition of Fe-Sn from the chloride-based electrolyte. Transactions of the Institute of Metal Finishing, 97 (5). pp. 247-253. ISSN 0020-2967

Andreou, Eleni and Roy, Sudipta; Mannion, Niall and Wainwright, Steve, eds. (2019) Electroforming of large scale nickel structures for leading-edge energy, aerospace and marine applications. In: Electrochem 2019, 2019-08-26 - 2019-08-28, The Technology and Innovation Centre (TIC), University of Strathclyde.

Debnath, Shaon and Roy, Sudipta and Green, Todd and Chen, Yi-Chieh (2019) Fibre-optic pH sensor based on silver nanoparticles for Harsh Environments. In: Electrochem 2019, 2019-08-26 - 2019-08-28, The Technology and Innovation Centre (TIC), University of Strathclyde.

Edet, John and Green, Todd and Roy, Sudipta (2019) Investigation of water absorption profile of mineral wool insulation. In: Electrochem 2019, 2019-08-26 - 2019-08-28, The Technology and Innovation Centre (TIC), University of Strathclyde.

2018

Bučko, M. and Roy, S. and Valverde-Armas, P. and Onjia, A. and Bastos, A. C. and Bajat, J. B. (2018) Voltammetric response of water in deep eutectic solvent based on choline chloride and urea. Journal of the Electrochemical Society, 165 (16). H1059-H1065. ISSN 0013-4651

Roy, Sudipta and Coleman, Simon (2018) Ultrasonic agitation for emerging electrodeposition systems. The Electrochemical Society: Interface, 27 (3). pp. 53-57. ISSN 1944-8783

Green, T. A. and Valverde, P. and Roy, S. (2018) Anodic reactions and the corrosion of copper in deep eutectic solvents. Journal of the Electrochemical Society, 165 (9). D313-D320. ISSN 0013-4651

Coleman, Simon J. and Roy, Sudipta (2018) Design of an ultrasonic tank reactor for copper deposition at electrodes separated by a narrow gap. Ultrasonics Sonochemistry, 42. pp. 445-451. ISSN 1350-4177

Valverde Armas, Priscila Estefania and Roy, Sudipta and Green, Todd (2018) Electrodeposition of Cu from a water-containing deep eutectic solvent. In: 22nd Topical meeting of the International Society of Electrochemistry (ISE) 2018, 2018-04-15 - 2018-04-18, Waseda University.

Dela Pena, Eden May Bayungan and Roy, Sudipta (2018) Electrodeposited copper using direct and pulse currents from electrolytes containing low concentration of additives. Surface and Coatings Technology, 339. pp. 101-110. ISSN 0257-8972

2017

Valverde, Priscila and Green, Todd and Roy, Sudipta (2017) Copper electrodeposition from a water-containing choline chloride based deep eutectic solvent. ECS Transactions, 77 (11). pp. 859-864. ISSN 1938-6737

Green, Todd and Su, Xiaomeng and Roy, Sudipta (2017) Pulse plating of copper from deep eutectic solvents. ECS Transactions, 77 (11). pp. 1247-1253. ISSN 1938-6737

Dela Pena, E. M. Bayungan and Roy, S. (2017) Electrochemical effect of copper gleam additives during copper electrodeposition. Transactions of the Institute of Metal Finishing, 95 (3). pp. 158-164. ISSN 0020-2967

Valverde, Priscila and Roy, Sudipta and Green, Todd (2017) Effect of water on Cu electrodeposition from ethaline based deep eutectic solvent. In: ChemEngUKDay 2017, 2017-03-27 - 2017-03-28, University of Birmingham.

Su, Xiaomeng and Green, Todd and Roy, Sudipta (2017) Electrodeposition of copper from deep eutectic solvents by using pulse current. In: ChemEngUKDay 2017, 2017-03-27 - 2017-03-28, University of Birmingham.

Roy, Sudipta and Valverde Armas, Priscila Estefania and Bucko, Mihael and Bajat, Jelena B. (2017) The influence of water on the cathodic voltammetric responses of choline chloride-urea and choline chloride-ethylene glycol deep eutectic solvents. In: 12th International Workshop on Electrodeposited Nanostructures, 2017-03-16 - 2017-03-18, Hotel Serdika.

Green, T.A. and Roy, S. (2017) Application of a duplex diffusion layer model to pulse reverse plating. Transactions of the Institute of Metal Finishing, 95 (1). pp. 46-51. ISSN 0020-2967

2016

Dang, Trung-Dung and Banerjee, Arghya Narayan and Tran, Quang-Tung and Roy, Sudipta (2016) Fast degradation of dyes in water using manganese-oxide-coated diatomite for environmental remediation. Journal of Physics and Chemistry of Solids, 98. pp. 50-58. ISSN 0022-3697

Huyen, Pham T. and Dang, T.D. and Tung, Mai T. and Huyen, Nguyen T.T. and Green, T.A. and Roy, S. (2016) Electrochemical copper recovery from galvanic sludge. Hydrometallurgy, 164. pp. 295-303. ISSN 0304-386X

Serrà, Albert and Coleman, Simon J. and Gómez, Elvira and Green, T.A. and Vallés, Elisa and Vilana, Joan and Roy, Sudipta (2016) Sono-electrodeposition transfer of micro-scale copper patterns on to A7 substrates using a mask-less method. Electrochimica Acta, 207. pp. 207-217. ISSN 0013-4686

Valverde Armas, Priscila Estefania and Roy, Sudipta and Green, Todd (2016) Effect of water on Cu electrodeposition from deep eutectic solvents. In: University of Strathclyde Faculty of Engineering Research Presentation Day, 2016-06-22 - 2016-06-22, University of Strathclyde.

Su, Xiaomeng and Roy, Sudipta (2016) Electrodeposition from ionic liquids by using pulse current. In: University of Strathclyde Faculty Research Presentation Day, 2016-06-22 - 2016-06-22, University of Strathclyde.

Valverde Armas, Priscila Estefania and Roy, Sudipta and Green, Todd (2016) Effect of water in metal electrodeposition processes from deep eutectic solvents. In: 2016 Scotland and North England Electrochemistry Symposium, 2016-04-20 - 2016-04-20, Glasgow University.

2015

Dela Pena, E.M. and Bains, N. and Hussain, A. and Cobley, A. and Roy, Sudipta (2015) Effect of additive concentration during copper deposition using EnFACE electrolyte. Transactions of the Institute of Metal Finishing, 93 (6). pp. 288-293. ISSN 0020-2967

Ghosh, Swatilekha and Roy, Sudipta (2015) Codeposition of Cu-Sn from ethaline deep eutectic solvent. Electrochimica Acta, 183. pp. 27-36. ISSN 0013-4686

Pewnim, Naray and Roy, Sudipta (2015) Effect of fluorosurfactant additive during Cu-Sn codeposition from methanesulfonic acid. Journal of the Electrochemical Society, 162 (8). D360-D364. ISSN 0013-4651

Widayatno, Tri and Roy, Sudipta (2015) Initial study of nickel electrolyte for EnFACE process. International Journal of Science and Engineering, 8 (2). pp. 135-140. ISSN 2302-5743

2014

Coleman, S. and Roy, S. (2014) Effect of ultrasound on mass transfer during electrodeposition for electrodes separated by a narrow gap. Chemical Engineering Science, 113. pp. 35-44. ISSN 0009-2509

Varia, Jeet and Zegeye, Asfaw and Roy, Sudipta and Yahaya, Sani and Bull, Steve (2014) Shewanella putrefaciens for the remediation of Au3+, Co2+ and Fe3+ metal ions from aqueous systems. Biochemical Engineering Journal, 85. pp. 101-109. ISSN 1369-703X

Ghosh, Swatilekha and Roy, Sudipta (2014) Electrochemical copper deposition from an ethaline-CuCl2·2H2O DES. Surface and Coatings Technology, 238. pp. 165-173. ISSN 0257-8972

2012

Hansal, Wolfgang E. G. and Roy, Sudipta and Leisner, Peter and Green, Todd and Reichenbach, Andreas (2012) Pulse Plating. Eugen G Leuze Verlag KG. ISBN 978-3-87480-265-9