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2024

Roy, Sudipta and Andreou, Eleni (2024) Considerations for digitalisation of nickel electroforming. Transactions of the Institute of Metal Finishing, 102 (6). pp. 297-304. ISSN 0020-2967

2021

Andreou, Eleni and Roy, Sudipta (2021) Modelling the electroforming process : significance and challenges. Transactions of the Institute of Metal Finishing, 99 (6). pp. 299-305. ISSN 0020-2967

2019

Zajkoska, S. Mrkonjić and Mann, R. and Hansal, W. and Roy, S. and Kautek, W. (2019) Electrodeposition of Fe-Sn from the chloride-based electrolyte. Transactions of the Institute of Metal Finishing, 97 (5). pp. 247-253. ISSN 0020-2967

2017

Dela Pena, E. M. Bayungan and Roy, S. (2017) Electrochemical effect of copper gleam additives during copper electrodeposition. Transactions of the Institute of Metal Finishing, 95 (3). pp. 158-164. ISSN 0020-2967

Green, T.A. and Roy, S. (2017) Application of a duplex diffusion layer model to pulse reverse plating. Transactions of the Institute of Metal Finishing, 95 (1). pp. 46-51. ISSN 0020-2967

2015

Dela Pena, E.M. and Bains, N. and Hussain, A. and Cobley, A. and Roy, Sudipta (2015) Effect of additive concentration during copper deposition using EnFACE electrolyte. Transactions of the Institute of Metal Finishing, 93 (6). pp. 288-293. ISSN 0020-2967

2014

Smith, James R. and Lamprou, Dimitrios (2014) Polymer coatings for biomedical applications : a review. Transactions of the Institute of Metal Finishing, 92 (1). pp. 9-19. ISSN 0020-2967 (In Press)