Electrochemical effect of copper gleam additives during copper electrodeposition

Dela Pena, E. M. Bayungan and Roy, S. (2017) Electrochemical effect of copper gleam additives during copper electrodeposition. Transactions of the Institute of Metal Finishing, 95 (3). pp. 158-164. ISSN 0020-2967

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    Abstract

    Electrochemical nano and micro fabrication by flow and chemistry is a maskless micro-patterning technology that uses an acid-free and low ion concentration electrolyte. However, the effects of additives on the electrochemical behaviour of this type of electrolyte are still unknown; hence, their role during micro- and nano-fabrication is unpredictable. This study reports the effect of a suppressor (Copper Gleam B), an accelerator (Copper Gleam A) and a promoter (Cl−) on the electrochemical behaviour of copper reduction. The three additives, when employed separately, were found to increase cathode polarisation. The combination of Copper Gleam B and Cl− showed strong inhibition, particularly in the diffusion-limited region. The addition of Copper Gleam A to the Copper Gleam B–Cl− mix increased the limiting current and suggested plating acceleration. These effects are interpreted in terms of the adsorption–desorption behaviour of the additives on the cathode surface.