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Roy, Sudipta and Andreou, Eleni (2024) Considerations for digitalisation of nickel electroforming. Transactions of the Institute of Metal Finishing, 102 (6). pp. 297-304. ISSN 0020-2967
Andreou, Eleni and Roy, Sudipta (2021) Modelling the electroforming process : significance and challenges. Transactions of the Institute of Metal Finishing, 99 (6). pp. 299-305. ISSN 0020-2967
Zajkoska, S. Mrkonjić and Mann, R. and Hansal, W. and Roy, S. and Kautek, W. (2019) Electrodeposition of Fe-Sn from the chloride-based electrolyte. Transactions of the Institute of Metal Finishing, 97 (5). pp. 247-253. ISSN 0020-2967
Dela Pena, E. M. Bayungan and Roy, S. (2017) Electrochemical effect of copper gleam additives during copper electrodeposition. Transactions of the Institute of Metal Finishing, 95 (3). pp. 158-164. ISSN 0020-2967
Green, T.A. and Roy, S. (2017) Application of a duplex diffusion layer model to pulse reverse plating. Transactions of the Institute of Metal Finishing, 95 (1). pp. 46-51. ISSN 0020-2967
Dela Pena, E.M. and Bains, N. and Hussain, A. and Cobley, A. and Roy, Sudipta (2015) Effect of additive concentration during copper deposition using EnFACE electrolyte. Transactions of the Institute of Metal Finishing, 93 (6). pp. 288-293. ISSN 0020-2967
Smith, James R. and Lamprou, Dimitrios (2014) Polymer coatings for biomedical applications : a review. Transactions of the Institute of Metal Finishing, 92 (1). pp. 9-19. ISSN 0020-2967 (In Press)