Codeposition of Cu-Sn from ethaline deep eutectic solvent

Ghosh, Swatilekha and Roy, Sudipta (2015) Codeposition of Cu-Sn from ethaline deep eutectic solvent. Electrochimica Acta. ISSN 0013-4686

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    Abstract

    Copper and tin have been co-deposited from choline chloride ethylene glycol based deep eutectic solvent (DES) containing CuCl2.2H2O and SnCl2.2H2O. Initially, electrolyte formulation experiments were carried out containing different amounts of copper and tin at a brass cathode in a rotating cylinder Hull cell. It was found that metallic deposits containing copper and tin could be deposited from a DES containing 0.02 M CuCl2.2H2O and 0.1 M SnCl2.2H2O. Polarization scans were carried out to determine the reduction potentials for individual metals and alloys. Anodic stripping voltammetry showed that Sn co-deposits with Cu at -0.36 V, at a lower over-potential than the tin reduction potential. Smooth and bright deposits of thicknesses up to 10 μm were obtained at a potential of -0.36 V or by using a current density of −0.87 × 10−3 A cm−2. XRD analysis showed the formation of mainly Cu3Sn and some Cu5Sn6. Our results suggest that Sn is co-discharged with Cu at potentials which is noble compared to the reduction potential of the individual metal.

    Author(s):Ghosh, Swatilekha and Roy, Sudipta ORCID logoORCID: https://orcid.org/0000-0002-3399-035X
    Item type:Article
    ID code:54659
    Keywords:choline chloride, copper-tin alloy, deep eutectic solvents, electrodeposition, ethaline, Chemical engineering, Electrochemistry, Chemical Engineering(all)
    Subjects:Technology > Chemical engineering
    Department:Faculty of Engineering > Chemical and Process Engineering
    Depositing user: Pure Administrator
    Date deposited:11 Dec 2015 01:06
    Last modified:24 Jan 2020 02:52
    Related URLs:
    URI:https://strathprints.strath.ac.uk/id/eprint/54659
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