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Strathprints makes available scholarly Open Access content by researchers in the Department of Mathematics & Statistics.

Mathematics & Statistics hosts the Marine Population Modelling group which is engaged in research into topics surrounding marine resource modelling and ecology. Recent work has included important developments in the population modelling of marine species.

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Number of items: 20.

Article

Tambe, C. Enowmbi and Green, T.A. and Roy, S. (2024) The multifaceted role of boric acid in nickel electrodeposition and electroforming. Journal of the Electrochemical Society, 171 (10). 102503. ISSN 0013-4651

Green, T. A. and Roy, S. (2023) Influence of corrosion reactions on the pulse electrodeposition of metals and alloys. Journal of the Electrochemical Society, 170 (12). 122503. ISSN 0013-4651

Green, Todd and Tambe, Christine Enowmbi and Roy, Sudipta (2022) Characteristics of anode materials for nickel electroforming. Journal of the Electrochemical Society, 169 (9). 092510. ISSN 0013-4651

Green, T.A. and Su, X. and Roy, S. (2021) Pulse electrodeposition of copper in the presence of a corrosion reaction. Journal of the Electrochemical Society, 168 (6). 062515. ISSN 0013-4651

Valverde, P. E. and Green, T. A. and Roy, S. (2020) Effect of water on the electrodeposition of copper from a deep eutectic solvent. Journal of Applied Electrochemistry, 50 (6). pp. 699-712. ISSN 0021-891X

Green, T. A. and Valverde, P. and Roy, S. (2018) Anodic reactions and the corrosion of copper in deep eutectic solvents. Journal of the Electrochemical Society, 165 (9). D313-D320. ISSN 0013-4651

Valverde, Priscila and Green, Todd and Roy, Sudipta (2017) Copper electrodeposition from a water-containing choline chloride based deep eutectic solvent. ECS Transactions, 77 (11). pp. 859-864. ISSN 1938-6737

Green, Todd and Su, Xiaomeng and Roy, Sudipta (2017) Pulse plating of copper from deep eutectic solvents. ECS Transactions, 77 (11). pp. 1247-1253. ISSN 1938-6737

Green, T.A. and Roy, S. (2017) Application of a duplex diffusion layer model to pulse reverse plating. Transactions of the Institute of Metal Finishing, 95 (1). pp. 46-51. ISSN 0020-2967

Huyen, Pham T. and Dang, T.D. and Tung, Mai T. and Huyen, Nguyen T.T. and Green, T.A. and Roy, S. (2016) Electrochemical copper recovery from galvanic sludge. Hydrometallurgy, 164. pp. 295-303. ISSN 0304-386X

Serrà, Albert and Coleman, Simon J. and Gómez, Elvira and Green, T.A. and Vallés, Elisa and Vilana, Joan and Roy, Sudipta (2016) Sono-electrodeposition transfer of micro-scale copper patterns on to A7 substrates using a mask-less method. Electrochimica Acta, 207. pp. 207-217. ISSN 0013-4686

Green, T. A. (2014) Gold etching for microfabrication. Gold Bulletin, 47 (3). pp. 205-216. ISSN 2190-7579

Conference or Workshop Item

Debnath, Shaon and Roy, Sudipta and Green, Todd and Chen, Yi-Chieh (2019) Fibre-optic pH sensor based on silver nanoparticles for Harsh Environments. In: Electrochem 2019, 2019-08-26 - 2019-08-28, The Technology and Innovation Centre (TIC), University of Strathclyde.

Edet, John and Green, Todd and Roy, Sudipta (2019) Investigation of water absorption profile of mineral wool insulation. In: Electrochem 2019, 2019-08-26 - 2019-08-28, The Technology and Innovation Centre (TIC), University of Strathclyde.

Valverde Armas, Priscila Estefania and Roy, Sudipta and Green, Todd (2018) Electrodeposition of Cu from a water-containing deep eutectic solvent. In: 22nd Topical meeting of the International Society of Electrochemistry (ISE) 2018, 2018-04-15 - 2018-04-18, Waseda University.

Valverde, Priscila and Roy, Sudipta and Green, Todd (2017) Effect of water on Cu electrodeposition from ethaline based deep eutectic solvent. In: ChemEngUKDay 2017, 2017-03-27 - 2017-03-28, University of Birmingham.

Su, Xiaomeng and Green, Todd and Roy, Sudipta (2017) Electrodeposition of copper from deep eutectic solvents by using pulse current. In: ChemEngUKDay 2017, 2017-03-27 - 2017-03-28, University of Birmingham.

Valverde Armas, Priscila Estefania and Roy, Sudipta and Green, Todd (2016) Effect of water on Cu electrodeposition from deep eutectic solvents. In: University of Strathclyde Faculty of Engineering Research Presentation Day, 2016-06-22 - 2016-06-22, University of Strathclyde.

Valverde Armas, Priscila Estefania and Roy, Sudipta and Green, Todd (2016) Effect of water in metal electrodeposition processes from deep eutectic solvents. In: 2016 Scotland and North England Electrochemistry Symposium, 2016-04-20 - 2016-04-20, Glasgow University.

Book

Hansal, Wolfgang E. G. and Roy, Sudipta and Leisner, Peter and Green, Todd and Reichenbach, Andreas (2012) Pulse Plating. Eugen G Leuze Verlag KG. ISBN 978-3-87480-265-9

This list was generated on Sun Dec 22 05:34:41 2024 GMT.