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Dela Pena, Eden May Bayungan and Roy, Sudipta (2018) Electrodeposited copper using direct and pulse currents from electrolytes containing low concentration of additives. Surface and Coatings Technology, 339. pp. 101-110. ISSN 0257-8972
Dela Pena, E. M. Bayungan and Roy, S. (2017) Electrochemical effect of copper gleam additives during copper electrodeposition. Transactions of the Institute of Metal Finishing, 95 (3). pp. 158-164. ISSN 0020-2967
Dela Pena, E.M. and Bains, N. and Hussain, A. and Cobley, A. and Roy, Sudipta (2015) Effect of additive concentration during copper deposition using EnFACE electrolyte. Transactions of the Institute of Metal Finishing, 93 (6). pp. 288-293. ISSN 0020-2967