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2025
Liang, Shuibao and Jiang, Han and Zhou, Rongxin and Xu, Yaohua and Ramachandran, Saranarayanan (2025) Study on thermomigration-induced void formation in advanced copper interconnects. IEEE Transactions on Components, Packaging and Manufacturing Technology. ISSN 2156-3950
2017
Diyaroglu, Cagan and Oterkus, Selda and Oterkus, Erkan and Madenci, Erdogan (2017) Peridynamic modeling of diffusion by using finite element analysis. IEEE Transactions on Components, Packaging and Manufacturing Technology, 7 (11). pp. 1823-1831. ISSN 2156-3950