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Liang, Shuibao and Jiang, Han and Zhou, Rongxin and Xu, Yaohua and Ramachandran, Saranarayanan (2025) Study on thermomigration-induced void formation in advanced copper interconnects. IEEE Transactions on Components, Packaging and Manufacturing Technology. ISSN 2156-3950
Diyaroglu, Cagan and Oterkus, Selda and Oterkus, Erkan and Madenci, Erdogan (2017) Peridynamic modeling of diffusion by using finite element analysis. IEEE Transactions on Components, Packaging and Manufacturing Technology, 7 (11). pp. 1823-1831. ISSN 2156-3950