Browse by Author or creator

2026

Jiang, Han and Xu, Yaohua and Ramachandran, Saranarayanan and Liang, Shuibao (2026) Torque-driven grain rotation in solder interconnects under electromigration for advanced packaging : insights from phase-field simulations. ACS Applied Materials and Interfaces, 18 (25). 36263–36275. ISSN 1944-8252

Jiang, Han and Liang, Shuibao and Xu, Yaohua and Ramachandran, Saranarayanan (2026) Electromigration degradation of buried power rails considering grain evolution in stacked integration. IEEE Transactions on Components, Packaging and Manufacturing Technology. ISSN 2156-3950

Liang, Shuibao and Guo, Zhihao and Jiang, Han and Zhong, Zhihong and Xu, Yaohua and Wang, Yi and Ramachandran, Saran (2026) Thermomechanical and fatigue analysis of SiC power modules with a comparison of sintered silver and copper die attaches. Journal of Electronic Materials, 55 (2). pp. 1570-1581. ISSN 0361-5235

Yang, Lu and Ramachandran, Saranarayanan and Bagasol, Axieh and Wu, Fan and Guan, Qiyu and Browne, David J. and Dowling, Denis and Mirihanage, Wajira (2026) Analysis and optimisation of parent grain reconstruction for additively manufactured Ti-6Al-4V. International Journal of Lightweight Materials and Manufacture, 9 (1). pp. 91-102. ISSN 2588-8404

Wu, Fan and Mullen, Jonathan and Deng, Yangchao and Marathe, Shashidhara and Ramachandran, Saran and Celkin, Mert and Murphy, Andrew and Sillekens, Wim and Mirihanage, Wajira and Browne, David (2026) Probing dendrite growth under microgravity via machine learning-aided multi-scale characterisation. Acta Materialia, 302. 121659. ISSN 1359-6454

2025

Jiang, Han and Liang, Shuibao and Ramachandran, Saran and Xu, Yaohua (2025) Physically based simulation of electromigration-induced hillock and void evolution in Cu interconnects with grain morphology considerations. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. ISSN 1937-4151

Jiang, Han and Chen, Jingyu and Ramachandran, Saran and Liang, Shuibao (2025) Unraveling thermo-mechanical stress-driven grain evolution and rotation in through-silicon vias for advanced packaging. Chip. 100176. ISSN 2709-4723

Guo, Z. and Liang, S. and Ramachandran, S. and Jiang, H. and Xu, Y. and Zhong, Z. (2025) Microstructure-based fatigue analysis of SiC power module with sintered silver die attach. Power Electronic Devices and Components, 12. 100121. ISSN 2772-3704

Jiang, Han and Li, Susu and Li, Zhenchao and Zhang, Leyin and Xu, Yaohua and Ramachandran, Saranarayanan and Liang, Shuibao (2025) Grain morphology effects on void formation and electromigration-induced failure in copper interconnects. IEEE Transactions on Semiconductor Manufacturing, 38 (4). 850 - 857. ISSN 0894-6507

Liang, Shuibao and Jiang, Han and Zhong, Zhihong and Xu, Yaohua and Ramachandran, Saranarayanan (2025) Influence of phase coarsening on inhomogeneous deformation and fracture behavior in Sn–Bi solder interconnects. IEEE Transactions on Device and Materials Reliability, 25 (3). pp. 585-593. ISSN 1530-4388

Liang, Shuibao and Jiang, Han and Zhou, Rongxin and Xu, Yaohua and Ramachandran, Saranarayanan (2025) Study on thermomigration-induced void formation in advanced copper interconnects. IEEE Transactions on Components, Packaging and Manufacturing Technology, 15 (8). pp. 1692-1697. ISSN 2156-3950

Jiang, Han and Liang, Shuibao and Xu, Yaohua and Ramachandran, Saranarayanan (2025) Investigation of electro-thermo-mechanical degradation and crack propagation of wire bonds in power modules using integrated phase field modelling and finite element analysis. IEEE Transactions on Power Electronics, 40 (2). pp. 3600-3609. ISSN 0885-8993

2024

Naab, Bryan and Ramachandran, Saranarayanan and Mirihanage, Wajira and Celikin, Mert (2024) Fatigue prediction through quantification of critical defects and crack growth behaviour in additively manufactured Ti-6Al-4V alloy. Materials Science and Engineering: A, 903. 146658. ISSN 0921-5093

2023

Yang, Lu and Ramachandran, Saranarayanan and Bagasol, Axieh and Guan, Qiyu and Wang, Weiguang and Browne, David J. and Dowling, Denis and Mirihanage, Wajira (2023) Solidification microstructure variations in additively manufactured Ti-6Al-4V using laser powder bed fusion. Scripta Materialia, 231. 115430. ISSN 1359-6462

Bagasol, Axieh Joy I. and Kaschel, Federico R. and Ramachandran, Saranarayanan and Mirihanage, Wajira and Browne, David J. and Dowling, Denis P. (2023) The influence of a large build area on the microstructure and mechanical properties of PBF-LB Ti-6Al-4 V alloy. The International Journal of Advanced Manufacturing Technology, 125 (3-4). pp. 1355-1369. ISSN 1433-3015

2022

Wu, F. and Falch, K.V. and Ramachandran, S. and Drakopoulos, M. and Mirihanage, W.U. (2022) X-ray imaging of complex flow patterns during tungsten inert gas welding. Journal of Materials Engineering and Performance, 31 (9). 7114–7119. ISSN 1059-9495

Ramachandran, S. and Zhong, Yi and Robertson, Stuart and Panteli, Christoforos and Liang, Shuibao and Wu, Fan and Zhou, Renqian and Marathe, Shashidhara and Zhou, Zhaoxia and S. Holmes, Andrew and J. Haigh, Sarah and Liu, Changqing and Mirihanage, Wajira (2022) Fast in-situ synchrotron X-ray imaging of the interfacial reaction during self-propagating exothermic reactive bonding. Materialia, 23. 101444. ISSN 2589-1529

2021

Ramachandran, S. and Lakshminarayanan, A. K. and Reed, P. A. S. and Dulieu-Barton, J. M. (2021) Application of imaging techniques to determine the post-yield behaviour of the heterogeneous microstructure of friction stir welds. Experimental Mechanics, 61. 1045–1063. ISSN 0014-4851

2019

Ramachandran, S. and Lakshminarayanan, A. K. and Reed, Philippa and Dulieu-Barton, J. M. (2019) Development of high-fidelity imaging procedures to establish the local material behavior in friction stir welded stainless steel joints. Metals, 9 (5). 592. ISSN 2075-4701

2015

Lakshminarayanan, A. K. and Saranarayanan, R. and Karthik Srinivas, V. and Venkatraman, B. (2015) Characteristics of friction welded AZ31B magnesium–commercial pure titanium dissimilar joints. Journal of Magnesium and Alloys, 3 (4). pp. 315-321. ISSN 2213-9567