Electrodeposition from ionic liquids by using pulse current

Su, Xiaomeng and Roy, Sudipta (2016) Electrodeposition from ionic liquids by using pulse current. In: University of Strathclyde Faculty Research Presentation Day, 2016-06-22 - 2016-06-22, University of Strathclyde.

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Abstract

Metal electroplating is of great significance in various industries such as electronics, sensors and optics, traditionally the process was performed in aqueous solution. However, they suffer a number of drawbacks such as poor deposit quality for some metals and environmental concerns [1]. The ionic liquid can overcome these limitations by aqueous solution [2]. In addition, the plating process can also be improved by applying pulse current instead of conventional direct current [3]. Therefore, it is worthy to investigate the combination effect of the utilization of both ionic liquid and pulse current in metal deposition.

ORCID iDs

Su, Xiaomeng ORCID logoORCID: https://orcid.org/0000-0001-8602-3366 and Roy, Sudipta ORCID logoORCID: https://orcid.org/0000-0002-3399-035X;
CORE (COnnecting REpositories)