Effect of water on Cu electrodeposition from deep eutectic solvents

Valverde Armas, Priscila Estefania and Roy, Sudipta and Green, Todd (2016) Effect of water on Cu electrodeposition from deep eutectic solvents. In: University of Strathclyde Faculty of Engineering Research Presentation Day, 2016-06-22 - 2016-06-22, University of Strathclyde.

ORCID iDs

Valverde Armas, Priscila Estefania ORCID: https://orcid.org/0000-0002-7211-1127

Roy, Sudipta ORCID: https://orcid.org/0000-0002-3399-035X

Green, Todd ORCID: https://orcid.org/0000-0002-3538-5217

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• Item metadata

  Item type:	Conference or Workshop Item(Poster)
  ID code:	60506
  Dates:	Date Event 22 June 2016 Published
  Subjects:	Technology > Chemical engineering
  Department:	Faculty of Engineering > Chemical and Process Engineering
  Depositing user:	Pure Administrator
  Date deposited:	24 Apr 2017 10:39
  Last modified:	11 Nov 2024 16:50
  Related URLs:	https://www.strath.ac.uk/engineering/get...
  URI:	https://strathprints.strath.ac.uk/id/eprint/60506