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Green, Todd and Su, Xiaomeng and Roy, Sudipta (2017) Pulse plating of copper from deep eutectic solvents. ECS Transactions, 77 (11). pp. 1247-1253. ISSN 1938-6737
Su, Xiaomeng and Green, Todd and Roy, Sudipta (2017) Electrodeposition of copper from deep eutectic solvents by using pulse current. In: ChemEngUKDay 2017, 2017-03-27 - 2017-03-28, University of Birmingham.
Su, Xiaomeng and Roy, Sudipta (2016) Electrodeposition from ionic liquids by using pulse current. In: University of Strathclyde Faculty Research Presentation Day, 2016-06-22 - 2016-06-22, University of Strathclyde.
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