Electrodeposited copper using direct and pulse currents from electrolytes containing low concentration of additives

Dela Pena, Eden May Bayungan and Roy, Sudipta (2018) Electrodeposited copper using direct and pulse currents from electrolytes containing low concentration of additives. Surface and Coatings Technology, 339. pp. 101-110. ISSN 0257-8972 (https://doi.org/10.1016/j.surfcoat.2018.01.067)

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Abstract

This work examines the effect of pulse deposition using a "lean" electrolyte, i.e., an acid-free bath with low cupric ion and additive concentrations using direct and pulse current. To this end, 25 μm copper films have been plated on stainless steel substrates from electrolytes containing only cupric ions, chloride and commercial additives. Films have been deposited from electrolytes containing different concentrations of additives ranging from 17% to 200% of the levels recommended by the supplier. The morphology of deposits was characterised using scanning electron microscopy and grain size has been determined using electron backscattered diffraction (EBSD). The crystalline structure has been examined using x-ray diffraction (XRD). It was found that although pulse currents or increasing amounts of chemical additive can reduce the grain size, the mechanisms for size reduction may be different. While current pulsing helps the generation of new nuclei, using additives suppresses grain growth. Mechanical and electrical measurements of these films showed that pulsing currents provide deposits with better mechanical and electrical properties. This has been attributed to lower number of defects when pulse currents are used. Our results also show that by using pulse currents, electrolytes containing low levels of additives and metal ions can be used to obtain copper deposits attaining industry specifications. Combining pulse currents with lean electrolytes may be therefore beneficial to the environment.

ORCID iDs

Dela Pena, Eden May Bayungan and Roy, Sudipta ORCID logoORCID: https://orcid.org/0000-0002-3399-035X;
  • Item type:Article
    ID code:63042
    Dates:
    Date
    Event
    15 April 2018
    Published
    2 February 2018
    Published Online
    21 January 2018
    Accepted
    10 September 2017
    Submitted
    Notes:© 2018 Published by Elsevier B.V. Eden May Dela Pena, Sudipta Roy, Electrodeposited copper using direct and pulse currents from electrolytes containing low concentration of additives, Surface and Coatings Technology, Volume 339, 2018, Pages 101-110, https://doi.org/10.1016/j.surfcoat.2018.01.067
    Subjects:Technology > Chemical engineering
    Department:Faculty of Engineering > Chemical and Process Engineering
    Depositing user: Pure Administrator
    Date deposited:25 Jan 2018 12:04
    Last modified:20 Nov 2024 01:15
    Related URLs:
    URI:https://strathprints.strath.ac.uk/id/eprint/63042
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