Hygro-thermo-mechanical analysis and failure prediction in electronic packages by using peridynamics

Tools

Oterkus, Selda and Madenci, Erdogan and Oterkus, Erkan and Hwang, Yuchul and Bae, Jangyong and Han, Sungwon; (2014) Hygro-thermo-mechanical analysis and failure prediction in electronic packages by using peridynamics. In: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC). IEEE, GBR, pp. 973-982. ISBN 9781479924073 (https://doi.org/10.1109/ECTC.2014.6897407)

[thumbnail of Oterkus-etal-IEEE-ECTC-2014-Hygro-thermo-mechanical-analysis-and-failure-prediction-in-electronic-packages]
Preview
 Text. Filename: Oterkus_etal_IEEE_ECTC_2014_Hygro_thermo_mechanical_analysis_and_failure_prediction_in_electronic_packages.pdf
Accepted Author Manuscript
Download (7MB)| Preview

Abstract

This study presents an integrated approach for the simulation of hygro-thermo-vapor-deformation analysis of electronic packages by using peridynamics. This theory is suitable for such analysis because of its mathematical structure. Its governing equation is an integro-differential equation and it is valid regardless of the existence of material and geometric discontinuities in the structure. It permits the specification of distinct properties of interfaces between dissimilar materials in the direct modeling of thermal and moisture diffusion, and deformation. Therefore, it enables progressive damage analysis in materials or layered material systems such as the electronic packages. It describes the validation procedure by considering a particular package for each thermomechanical, hygromechanical deformation as well as vapor pressure predictions. Also, it presents results concerning failure sites and mechanisms due to hygro-thermo-vapor-deformation.

ORCID iDs

Oterkus, Selda ORCID logoORCID: https://orcid.org/0000-0003-0474-0279, Madenci, Erdogan, Oterkus, Erkan ORCID logoORCID: https://orcid.org/0000-0002-4614-7214, Hwang, Yuchul, Bae, Jangyong and Han, Sungwon;
CORE (COnnecting REpositories)