Browse by ISBN
Jump to: O
Number of items: 1.
O
Oterkus, Selda and Madenci, Erdogan and Oterkus, Erkan and Hwang, Yuchul and Bae, Jangyong and Han, Sungwon; (2014) Hygro-thermo-mechanical analysis and failure prediction in electronic packages by using peridynamics. In: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC). IEEE, GBR, pp. 973-982. ISBN 9781479924073