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Blair, E. O. and Buchoux, A. and Tsiamis, A. and Dunare, C. and Marland, J.R.K. and Terry, J.G. and Smith, S. and Walton, A.J.; (2017) Test structures for the characterisation of sensor packaging technology. In: 2017 International Conference of Microelectronic Test Structures (ICMTS). IEEE, FRA. ISBN 9781509036165