Test structures for the characterisation of sensor packaging technology

Blair, E. O. and Buchoux, A. and Tsiamis, A. and Dunare, C. and Marland, J.R.K. and Terry, J.G. and Smith, S. and Walton, A.J. (2017) Test structures for the characterisation of sensor packaging technology. In: 2017 International Conference of Microelectronic Test Structures (ICMTS). IEEE, Piscataway, N.J.. ISBN 9781509036165

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    Abstract

    This paper presents three test structures targeted at characterising sensor packaging materials for liquid environments. The test structures enable the evaluation of: 1) the successful removal of packaging material on sensing areas, 2) the permeability of the packaging material to its environment, 3) electrical continuity through the packaging process, and 4) the ingress of the liquid environment between the packaging material and the chip surface. The paper presents an example of the evaluation of a UV curable resin as packaging process for a biomedical sensor.

    Author(s):Blair, E. O. ORCID logoORCID: https://orcid.org/0000-0002-1887-8001, Buchoux, A., Tsiamis, A., Dunare, C., Marland, J.R.K., Terry, J.G., Smith, S. and Walton, A.J.
    Item type:Book Section
    ID code:66105
    Keywords:resins, packaging, electrodes, current measurement, aluminum wires, electronics packaging, Electrical engineering. Electronics Nuclear engineering, Electrical and Electronic Engineering
    Subjects:Technology > Electrical engineering. Electronics Nuclear engineering
    Department:Faculty of Engineering > Biomedical Engineering
    Depositing user: Pure Administrator
    Date deposited:14 Nov 2018 14:14
    Last modified:21 Aug 2019 09:13
    Related URLs:
    URI:https://strathprints.strath.ac.uk/id/eprint/66105
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