Bulletin board : report on the 2022 IEEE DEIS summer school in Monmouth, Wales

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Bill, Fabian and Hu, Frances and Ratheiser, Patrik and Wong, Timothy (2023) Bulletin board : report on the 2022 IEEE DEIS summer school in Monmouth, Wales. IEEE Electrical Insulation Magazine, 39 (2). pp. 55-59. ISSN 0883-7554 (https://doi.org/10.1109/MEI.2023.10044610)

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Abstract

From August 21 to 25, 2022, the sixth annual IEEE DEIS-sponsored Summer School on Extra-High Voltage DC (EHVDC) Transmission took place in Monmouth, located on the border between England and Wales, UK. Unfortunately, the summer school was not spared from the COVID-19 pandemic, which, as many of us know, has become a constant companion in our everyday lives. As a result of some cases of illness among the moderators and speakers, the summer school was quickly adapted into an all-too-familiar hybrid event. However, this made it possible for all participants to attend all presentations, network, and exchange ideas in the best way possible, while also staying safe.

ORCID iDs

Bill, Fabian, Hu, Frances, Ratheiser, Patrik and Wong, Timothy ORCID logoORCID: https://orcid.org/0000-0001-6525-814X;
  • Item type:Article
    ID code:84832
    Dates:
    Date
    Event
    30 April 2023
    Published
    14 February 2023
    Published Online
    22 December 2022
    Accepted
    Notes:© 2023 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting /republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
    Subjects:Technology > Electrical engineering. Electronics Nuclear engineering
    Department:Faculty of Engineering > Electronic and Electrical Engineering
    Depositing user: Pure Administrator
    Date deposited:21 Mar 2023 14:47
    Last modified:11 Nov 2024 13:51
    URI:https://strathprints.strath.ac.uk/id/eprint/84832
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