Cutting-based single atomic layer removal mechanism of monocrystalline copper : edge radius effect

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Xie, Wenkun and Fang, Fengzhou (2019) Cutting-based single atomic layer removal mechanism of monocrystalline copper : edge radius effect. Nanoscale Research Letters, 14 (1). pp. 1-18. 370. ISSN 1931-7573 (https://doi.org/10.1186/s11671-019-3195-4)

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Abstract

The ultimate objective of mechanical cutting is to down minimum chip thickness to single atomic layer. In this study, the cutting-based single atomic layer removal mechanism on monocrystalline copper is investigated by a series of molecular dynamics analysis. The research findings report that when cutting depth decreases to atomic scale, minimum chip thickness could be down to single atomic layer by mechanical cutting using rounded edge tool. The material removal behaviour during cutting-based single atomic layer removal exhibits four characteristics, including chip formation by shearing-stress driven dislocation motion, elastic deformation on the processed surface, atomic sizing effect, and cutting-edge radius effect. Based on this understanding, a new cutting model is proposed to study the material removal behaviour in cutting-based single atomic layer removal process, significantly different from those for nanocutting and conventional cutting. The outcomes provide theoretical support for the research and development of the atomic and close-to-atomic scale manufacturing technology.

ORCID iDs

Xie, Wenkun ORCID logoORCID: https://orcid.org/0000-0002-5305-7356 and Fang, Fengzhou;
  • Item type:Article
    ID code:81380
    Dates:
    Date
    Event
    6 December 2019
    Published
    28 October 2019
    Accepted
    Notes:Funding Information: The authors would like to thank the finical support from Science Foundation Ireland (SFI) (No. 15/RP/B3208) and ‘111’ project by the State Administration of Foreign Experts Affairs and the Ministry of Education of China (Grant No. B07014). Publisher Copyright: © 2019, The Author(s). Xie, W., Fang, F. Cutting-based single atomic layer removal mechanism of monocrystalline copper: edge radius effect. Nanoscale Res Lett 14, 370 (2019). https://doi.org/10.1186/s11671-019-3195-4
    Subjects:Science > Physics
    Technology > Manufactures
    Department:Faculty of Engineering > Design, Manufacture and Engineering Management
    Depositing user: Pure Administrator
    Date deposited:07 Jul 2022 08:18
    Last modified:12 Dec 2024 13:22
    Related URLs:
    URI:https://strathprints.strath.ac.uk/id/eprint/81380
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