Influence of cutting parameters on the depth of subsurface deformed layer in nano-cutting process of single crystal copper

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Wang, Quanlong and Bai, Qingshun and Chen, Jiaxuan and Su, Hao and Wang, Zhiguo and Xie, Wenkun (2015) Influence of cutting parameters on the depth of subsurface deformed layer in nano-cutting process of single crystal copper. Nanoscale Research Letters, 10 (1). pp. 1-8. 396. ISSN 1931-7573 (https://doi.org/10.1186/s11671-015-1082-1)

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Abstract

Large-scale molecular dynamics simulation is performed to study the nano-cutting process of single crystal copper realized by single-point diamond cutting tool in this paper. The centro-symmetry parameter is adopted to characterize the subsurface deformed layers and the distribution and evolution of the subsurface defect structures. Three-dimensional visualization and measurement technology are used to measure the depth of the subsurface deformed layers. The influence of cutting speed, cutting depth, cutting direction, and crystallographic orientation on the depth of subsurface deformed layers is systematically investigated. The results show that a lot of defect structures are formed in the subsurface of workpiece during nano-cutting process, for instance, stair-rod dislocations, stacking fault tetrahedron, atomic clusters, vacancy defects, point defects. In the process of nano-cutting, the depth of subsurface deformed layers increases with the cutting distance at the beginning, then decreases at stable cutting process, and basically remains unchanged when the cutting distance reaches up to 24 nm. The depth of subsurface deformed layers decreases with the increase in cutting speed between 50 and 300 m/s. The depth of subsurface deformed layer increases with cutting depth, proportionally, and basically remains unchanged when the cutting depth reaches over 6 nm.

ORCID iDs

Wang, Quanlong, Bai, Qingshun, Chen, Jiaxuan, Su, Hao, Wang, Zhiguo and Xie, Wenkun ORCID logoORCID: https://orcid.org/0000-0002-5305-7356;
  • Item type:Article
    ID code:81310
    Dates:
    Date
    Event
    1 December 2015
    Published
    9 October 2015
    Published Online
    21 September 2015
    Accepted
    Notes:Funding Information: The authors appreciate the supports of the National Natural Science Foundation of China (grant no. 51475108). The authors would like to thank the valuable inputs from anonymous reviewers for improving the quality of this manuscript. Publisher Copyright: © 2015, Wang et al. Wang, Q., Bai, Q., Chen, J. et al. Influence of cutting parameters on the depth of subsurface deformed layer in nano-cutting process of single crystal copper. Nanoscale Res Lett 10, 396 (2015). https://doi.org/10.1186/s11671-015-1082-1
    Subjects:Technology > Manufactures
    Department:Faculty of Engineering > Design, Manufacture and Engineering Management
    Depositing user: Pure Administrator
    Date deposited:30 Jun 2022 10:44
    Last modified:21 Nov 2024 13:59
    Related URLs:
    URI:https://strathprints.strath.ac.uk/id/eprint/81310
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