Comparison of conventional and maskless lithographic techniques for More than Moore post-processing of foundry CMOS chips

Tsiamis, Andreas and Li, Yifan and Dunare, Camelia and Marland, Jamie R.K. and Blair, Ewen O. and Smith, Stewart and Terry, Jonathan G. and Mitra, Srinjoy and Underwood, Ian and Murray, Alan F. and Walton, Anthony J. (2020) Comparison of conventional and maskless lithographic techniques for More than Moore post-processing of foundry CMOS chips. Journal of Microelectromechanical Systems, 29 (5). pp. 1245-1252. 9173531. ISSN 1057-7157 (https://doi.org/10.1109/JMEMS.2020.3015964)

[thumbnail of Tsiamis-etal-2020-Comparison-of-conventional-and-maskless-lithographic-techniques-for-More-than-Moore]
Preview
Text. Filename: Tsiamis_etal_2020_Comparison_of_conventional_and_maskless_lithographic_techniques_for_More_than_Moore.pdf
Accepted Author Manuscript

Download (8MB)| Preview

Abstract

This article details and compares the technology options for post-processing foundry produced CMOS at chip-scale to enable More than Moore functionality. In many cases there are attractions in using chip-based processing through the Multi-Project Wafer route that is frequently employed in research, early-stage development and low-volume production. This article identifies that spray-based photoresist deposition combined with optical maskless lithography demonstrates sufficient performance combined with low cost and operational convenience to offer an attractive alternative to conventional optical lithography, where spin-coated photoresist is exposed through a patterned photomask.

ORCID iDs

Tsiamis, Andreas, Li, Yifan, Dunare, Camelia, Marland, Jamie R.K., Blair, Ewen O. ORCID logoORCID: https://orcid.org/0000-0002-1887-8001, Smith, Stewart, Terry, Jonathan G., Mitra, Srinjoy, Underwood, Ian, Murray, Alan F. and Walton, Anthony J.;