Test structures for developing packaging for implantable sensors

Blair, E. O. and Buchoux, A. and Tsiamis, A. and Dunare, C. and Marland, J. R. K. and Gray, M. E. and Terry, J. G. and Smith, S. and Walton, A. J. (2020) Test structures for developing packaging for implantable sensors. IEEE Transactions on Semiconductor Manufacturing, 33 (2). pp. 224-231. ISSN 0894-6507 (https://doi.org/10.1109/TSM.2020.2987134)

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Abstract

With their capacity for real time monitoring and spatial mapping, implantable sensors are becoming an increasingly important aspect of next generation precision healthcare. Microfabricated sensor systems are a popular choice, owing to their capacity for miniaturisation, repeatable mass manufacture, and numerous pre-existing sensor archetypes. Despite the drive for development, packaging these sensors for the environment within the body, as well as the implantation process itself, presents a significant challenge. This paper presents microelectronic test structures, which can be used to assess, compare, and optimise implantable packaging solutions in a standardised manner. The proposed structures are used to investigate: (i) the capacity of the material to be patterned, (ii) the permeability of the insulation material, (iii) adhesion of the encapsulant to the die, and (iv) the physical robustness of the package to implantation through a needle. They are used to characterise an example packaging strategy, using biocompatible epoxy-resin. In addition, a method of optimising the packaging performance using the test structures is presented.

  • Item type:Article
    ID code:72046
    Dates:
    Date
    Event
    31 May 2020
    Published
    15 April 2020
    Published Online
    6 April 2020
    Accepted
    Notes:© 2020 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting /republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
    Subjects:Technology > Electrical engineering. Electronics Nuclear engineering
    Department:Faculty of Engineering > Biomedical Engineering
    Depositing user: Pure Administrator
    Date deposited:16 Apr 2020 09:19
    Last modified:09 Apr 2024 01:25
    URI:https://strathprints.strath.ac.uk/id/eprint/72046
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