Analysis of electrodeposited nano-scale copper wire microstructure by EBSD method

Konkova, Tatyana and Ke, Yiqing and Mironov, Sergey and Onuki, Jin (2012) Analysis of electrodeposited nano-scale copper wire microstructure by EBSD method. In: Advanced Metallization Conference 2012: 22nd Asian Session, 2012-10-22 - 2012-10-25, The University of Tokyo.

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Abstract

The high-resolution electron backscatter diffraction (EBSD) technique was applied to study electrodeposited and subsequently annealed nano-scale copper wires. The mean grain size was found to be coarser than the mean free path of electrons (~ 40 nm). The wires were shown to contain a notable fraction of low-angle boundaries as well as annealing twins. The material was found have a strong {111}<110> texture.

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• Item metadata

  Item type:	Conference or Workshop Item(Paper)
  ID code:	68274
  Dates:	Date Event 2012 Published
  Subjects:	Technology > Engineering (General). Civil engineering (General) > Engineering design
  Department:	Faculty of Engineering > Design, Manufacture and Engineering Management
  Depositing user:	Pure Administrator
  Date deposited:	06 Jun 2019 11:50
  Last modified:	09 Apr 2024 06:38
  Related URLs:	Event
  URI:	https://strathprints.strath.ac.uk/id/eprint/68274