Analysis of electrodeposited nano-scale copper wire microstructure by EBSD method

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Konkova, Tatyana and Ke, Yiqing and Mironov, Sergey and Onuki, Jin (2012) Analysis of electrodeposited nano-scale copper wire microstructure by EBSD method. In: Advanced Metallization Conference 2012: 22nd Asian Session, 2012-10-22 - 2012-10-25, The University of Tokyo.

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Abstract

The high-resolution electron backscatter diffraction (EBSD) technique was applied to study electrodeposited and subsequently annealed nano-scale copper wires. The mean grain size was found to be coarser than the mean free path of electrons (~ 40 nm). The wires were shown to contain a notable fraction of low-angle boundaries as well as annealing twins. The material was found have a strong {111}<110> texture.

ORCID iDs

Konkova, Tatyana ORCID logoORCID: https://orcid.org/0000-0001-7495-7495, Ke, Yiqing, Mironov, Sergey and Onuki, Jin;
CORE (COnnecting REpositories)