Test structures for the characterisation of sensor packaging technology

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Blair, E. O. and Buchoux, A. and Tsiamis, A. and Dunare, C. and Marland, J.R.K. and Terry, J.G. and Smith, S. and Walton, A.J.; (2017) Test structures for the characterisation of sensor packaging technology. In: 2017 International Conference of Microelectronic Test Structures (ICMTS). IEEE, FRA. ISBN 9781509036165 (https://doi.org/10.1109/ICMTS.2017.7954279)

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Abstract

This paper presents three test structures targeted at characterising sensor packaging materials for liquid environments. The test structures enable the evaluation of: 1) the successful removal of packaging material on sensing areas, 2) the permeability of the packaging material to its environment, 3) electrical continuity through the packaging process, and 4) the ingress of the liquid environment between the packaging material and the chip surface. The paper presents an example of the evaluation of a UV curable resin as packaging process for a biomedical sensor.

ORCID iDs

Blair, E. O. ORCID logoORCID: https://orcid.org/0000-0002-1887-8001, Buchoux, A., Tsiamis, A., Dunare, C., Marland, J.R.K., Terry, J.G., Smith, S. and Walton, A.J.;
CORE (COnnecting REpositories)