A low cost patternable packaging technology for biosensors

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Buchoux, Anthony and Blair, Ewen O. and Tsiamis, Andreas and Marland, Jamie R.K. and Smith, Stewart; Charlot, Benoit and Mita, Yoshio and Nouet, Pascal and Pellet, Claude and Pressecq, Francis and Schneider, Peter and Smith, Stewart, eds. (2017) A low cost patternable packaging technology for biosensors. In: 2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017. IEEE, FRA. ISBN 9781538629529 (https://doi.org/10.1109/DTIP.2017.7984493)

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Abstract

This paper demonstrates a simple and low cost technology to reliably and accurately package integrated chips. Microchannels and cavities of minimum feature size of 500 μm can be reliably reproduced. In addition, the curing depth in relation to the exposure time was investigated. A simple microfluidic device, consisting of a 500 μm channel and 2 mm ports, was manufactured to demonstrate the possibilities of this technology. Extensive electrochemical experiments showed that the packaging material is a good insulator and leaves no residue on the chip.

ORCID iDs

Buchoux, Anthony, Blair, Ewen O. ORCID logoORCID: https://orcid.org/0000-0002-1887-8001, Tsiamis, Andreas, Marland, Jamie R.K. and Smith, Stewart; Charlot, Benoit, Mita, Yoshio, Nouet, Pascal, Pellet, Claude, Pressecq, Francis, Schneider, Peter and Smith, Stewart
CORE (COnnecting REpositories)