Peridynamic wetness approach for moisture concentration analysis in electronic packages

Diyaroglu, C. and Oterkus, S. and Oterkus, E. and Madenci, E. and Han, S. and Hwang, Y. (2017) Peridynamic wetness approach for moisture concentration analysis in electronic packages. Microelectronics Reliability, 70. pp. 103-111. (https://doi.org/10.1016/j.microrel.2017.01.008)

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Abstract

Within the finite element framework, a commonly accepted indirect approach employs the concept of normalized concentration to compute moisture concentration. It is referred to as “wetness” approach. If the saturated concentration value is not dependent on temperature or time, the wetness equation is analogous to the standard diffusion equation whose solution can be constructed by using any commercial finite element analysis software such as ANSYS. However, the time dependency of saturated concentration requires special treatment under temperature dependent environmental conditions such as reflow process. As a result, the wetness equation is not directly analogous to the standard diffusion equation. This study presents the peridynamic wetness modeling for time dependent saturated concentration for computation of moisture concentration in electronic packages. It is computationally efficient as well as easy to implement without any iterations in each time step. Numerical results concerning the one-dimensional analysis illustrate the accuracy of this approach. Moisture concentration calculation in a three-dimensional electronic package configuration with many different material layers demonstrates its robustness.

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