Microstructure evolution and surface cleaning of Cu nanoparticles during micro-fields activated sintering technology

Wu, Mingxia and Yang, Gang and Yang, Yi and Qin, Yi and Yin, Deqiang (2015) Microstructure evolution and surface cleaning of Cu nanoparticles during micro-fields activated sintering technology. In: 4th International Conference on New Forming Technology, 2015-08-06 - 2015-08-09, Crowne Plaza Glasgow. (https://doi.org/10.1051/matecconf/20152110002)

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Abstract

For the purpose of extensive utilization of powder metallurgy to micro/nano- fabrication of materials, the micro gear was prepared by a novel method, named as micro- forming fields activated sintering technology (Micro-FAST). Surface-cleaning of particles, especially during the initial stage of sintering, is a crucial issue for the densification mechanism. However, up to date, the mechanism of surface-cleaning is too complicated to be known. In this paper, the process of surface-cleaning of Micro-FAST was studied, employing the high resolution transmission electron microscopy (HRTEM) for observation of microstructure of micro-particles. According to the evolution of the microstructure, surface-cleaning is mainly ascribed to the effect of electro-thermal focusing. The process of surface-cleaning is achieved through rearrangement of grains, formation of vacancy, migration of vacancy and enhancement of electro-thermal focusing.

ORCID iDs

Wu, Mingxia, Yang, Gang, Yang, Yi, Qin, Yi ORCID logoORCID: https://orcid.org/0000-0001-7103-4855 and Yin, Deqiang;
CORE (COnnecting REpositories)