Effect of annealing temperature on structure of electrodeposited nano-scale copper wires

Ke, Y. and Konkova, T. and Mironov, S. and Ohnuki, J. (2012) Effect of annealing temperature on structure of electrodeposited nano-scale copper wires. Letters on Materials, 2 (4). pp. 198-201. ISSN 2410-3535 (https://doi.org/10.22226/2410-3535-2012-4-198-201)

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Abstract

High-resolution electron backscatter diffraction (EBSD) technique was employed to investigate structure evolution of electrodeposited and subsequently annealed nano-scale copper wires. The grain structure was found to be stable in the bottom area of a trench during the annealing process. The material was shown to exhibit a large fraction of low-angle boundaries as well as annealing twins.

ORCID iDs

Ke, Y., Konkova, T. ORCID logoORCID: https://orcid.org/0000-0001-7495-7495, Mironov, S. and Ohnuki, J.;
CORE (COnnecting REpositories)