PARAMOD metallization of circuit traces and microvias in photodefined dielectrics : Organic High Density Interconnect Structures (HDIS)

Kydd, P. H. and Jablonski, G. A. and Richard, D. L. and Gleskova, Helena; (1997) PARAMOD metallization of circuit traces and microvias in photodefined dielectrics : Organic High Density Interconnect Structures (HDIS). In: Organic High Density Interconnect Structures (HDIS). Institute for Interconnecting and Packaging Electronic Circuits, pp. 174-180. ISBN 9781580985239

Abstract

This paper explores PARAMOD metallization of circuit traces and microvias in photodefined dielectrics.

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• Item metadata

  Item type:	Book Section
  ID code:	47490
  Dates:	Date Event 21 November 1997 Published
  Notes:	M1 - Conference contribution
  Subjects:	UNSPECIFIED
  Department:	Faculty of Engineering > Electronic and Electrical Engineering
  Depositing user:	Pure Administrator
  Date deposited:	14 Apr 2014 22:28
  Last modified:	08 Apr 2024 13:09
  Related URLs:	http://www.worldcat.org/oclc/45508412
  URI:	https://strathprints.strath.ac.uk/id/eprint/47490