Simulation study of cutting forces, stresses and temperature during nanometric cutting of single crystal silicon

Goel, S. and Luo, X. and Reuben, R.L. and Rashid, W. Bin and Sun, J. N.; (2011) Simulation study of cutting forces, stresses and temperature during nanometric cutting of single crystal silicon. In: Key Engineering Materials. Trans Tech Publications Ltd, Durnten-Zurich, Switzerland, pp. 223-228. ISBN 9783037852972 (https://doi.org/10.4028/www.scientific.net/KEM.496...)

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Abstract

Wear of diamond tool has always been a limiting factor in ductile regime machining of large size silicon components. In order to understand the tool wear phenomena, it is non-trivial to know the process outputs especially cutting forces, stresses and temperature during nanometric turning. In this paper, a realistic potential energy function has been deployed through molecular dynamic (MD) simulation, to simulate the process outputs of single diamond turning operation against single crystal silicon. The simulation result suggests that wear mechanism of diamond tool is fundamentally governed by these process parameters and thus critical.

ORCID iDs

Goel, S., Luo, X. ORCID logoORCID: https://orcid.org/0000-0002-5024-7058, Reuben, R.L., Rashid, W. Bin and Sun, J. N.;
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