Flexible glass substrates with via holes for TFT backplanes

Gleskova, Helena and Ma, E.Y. and Wagner, S. and Shen, D.; (1996) Flexible glass substrates with via holes for TFT backplanes. In: Digest of technical papers. The Japan Society of Physics, JPN, pp. 105-108.

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Abstract

This paper looks at flexible glass substrates with via holes for TFT backplanes

ORCID iDs

Gleskova, Helena ORCID: https://orcid.org/0000-0001-7195-9639

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• Item metadata

  Item type:	Book Section
  ID code:	33498
  Dates:	Date Event November 1996 Published
  Subjects:	Technology > Electrical engineering. Electronics Nuclear engineering
  Department:	Faculty of Engineering > Electronic and Electrical Engineering
  Depositing user:	Pure Administrator
  Date deposited:	10 Nov 2011 16:45
  Last modified:	25 Jan 2025 12:30
  URI:	https://strathprints.strath.ac.uk/id/eprint/33498