An open letter to members of the ieee dielectrics and electrical insulation society

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Dissado, Len and Laurent, Christian and Montanari, Gian Carlo and Shimizu, Noriyuki and Fothergill, John and Lewin, Paul and Sekii, Yasuo and Fouracre, Tony (2008) An open letter to members of the ieee dielectrics and electrical insulation society. IEEE Electrical Insulation Magazine, 24 (5). p. 4. ISSN 0883-7554 (https://doi.org/10.1109/MEI.2008.4635654)

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Abstract

We, the undersigned, wish to express our concerns about the future of the CEIDP(Conference on Electrical Insulation andDielectric Phenomena), an important annual event in the calendar of the DEIS. Over many years, CEIDP has provided a valuable conference for our community. At present, many academic institutions encourage their staff to publish widely, and we believe there is a general needfor a strong quality assessment procedure for all the IEEE-sponsored conferences. However, we feel that the CEIDP Executive has not been responsive to suggestions for improvement in recent years and, as a result, the future of the conference is under threat. We therefore felt it necessary to write this open letter to which we would hope the DEIS membership would give support.

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