Hybrid integration of chipscale photonic devices using accurate transfer printing methods
Smith, J. A. and Jevtics, D. and Guilhabert, B. and Dawson, M. D. and Strain, M. J. (2022) Hybrid integration of chipscale photonic devices using accurate transfer printing methods. Applied Physics Reviews, 9 (4). 041317. ISSN 1931-9401 (https://doi.org/10.1063/5.0121567)
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Abstract
Transfer printing is becoming widely adopted as a back-end process for the hybrid integration of photonic and electronic devices. Integration of membrane components, with micrometer-scale footprints and sub-micron waveguide dimensions, imposes strict performance requirements on the process. In this review, we present an overview of transfer printing for integrated photonics applications, covering materials and fabrication process considerations, methods for efficient optical coupling, and high-accuracy inter-layer alignment. We present state-of-the-art integration demonstrations covering optical sources and detectors, quantum emitters, sensors, and opto-mechanical devices. Finally, we look toward future developments in the technology that will be required for dense multi-materials integration at wafer scales.
ORCID iDs
Smith, J. A., Jevtics, D. ORCID: https://orcid.org/0000-0002-6678-8334, Guilhabert, B. ORCID: https://orcid.org/0000-0002-3986-8566, Dawson, M. D. ORCID: https://orcid.org/0000-0002-6639-2989 and Strain, M. J. ORCID: https://orcid.org/0000-0002-9752-3144;-
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Item type: Article ID code: 83578 Dates: DateEvent8 December 2022Published8 December 2022Published Online16 November 2022AcceptedSubjects: Science > Physics
Technology > Engineering (General). Civil engineering (General) > Engineering designDepartment: Faculty of Science > Physics > Institute of Photonics Depositing user: Pure Administrator Date deposited: 20 Dec 2022 11:23 Last modified: 02 Dec 2024 01:27 URI: https://strathprints.strath.ac.uk/id/eprint/83578