Numerical and experimental investigation on boding strength optimization of glass fibers-reinforced epoxy composites on a structural steel substrate

Osouli-Bostanabad, K. and Tutunchi, A. and Eskandarzade, M. and Kianvash, A. (2019) Numerical and experimental investigation on boding strength optimization of glass fibers-reinforced epoxy composites on a structural steel substrate. Modares Mechanical Engineering, 19 (2). pp. 387-396. ISSN 1027-5940

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Abstract

Incidence of breaks and leakages in fluid transportation pipes is a common issue in Iran. Depending on the type of pipes and environmental conditions, the breaks in the pipes may be caused by different factors, including mechanical damages, internal or external corrosions, failures, or applied stresses. In the repair of damaged pipes, there are several strategies for rebuilding and implementing the pipeline, most of which are replacing the entire exhausted pipe, using weld clamps and using composite patches. In recent years, the use of composite patches has been accepted as a low-cost, permanent, and standard method for different pipe sections with the least interruption in transportation. In the present study, the boding strength of glass fibers-reinforced epoxy composite patches on a structural steel substrate were investigated and optimal conditions of achieving enhanced adhesion strength of composite patches on the steel substrate were determined, using the Tagochi method at various curing temperatures and times. In this regard, the tensile and shear strength of epoxy, cyanoacrylate, and methacrylate-based glues as three kinds of appropriate polymers for bonding the epoxy composite on the steel substrates were tested. The mechanical strength measurements and fractured interfaces evaluations using a scanning electron microscopy (SEM) revealed that the methacrylate-based glue has the better adhesion strength to the steel substrate.

ORCID iDs

Osouli-Bostanabad, K. ORCID logoORCID: https://orcid.org/0000-0003-4375-4948, Tutunchi, A., Eskandarzade, M. and Kianvash, A.;