Micromachining of a piezocomposite transducer using a copper vapour laser

Farlow, R. and Galbraith, W. and Knowles, M. and Hayward, G. (2001) Micromachining of a piezocomposite transducer using a copper vapour laser. IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control, 48 (3). pp. 639-640. ISSN 0885-3010

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Abstract

A 1-3 piezocomposite transducer with front face dimensions of 2×2 mm has been micromachined using a copper vapor laser. The device consists of PZT5A piezoceramic pillars with a 65-μm pitch suspended in a low viscosity thermosetting polymer. The kerf width is 13 μm, and the transducer thickness is 170 μm, making the device suitable for ultrasonic reception at frequencies close to 10 MHz.

Author(s):Farlow, R., Galbraith, W. ORCID logoORCID: https://orcid.org/0000-0002-5620-7807, Knowles, M. and Hayward, G.
Item type:Article
ID code:7100
Keywords:laser beam machining, lead compounds, micromachining, piezoceramics, ultrasonic transducers, Electrical engineering. Electronics Nuclear engineering, Instrumentation, Acoustics and Ultrasonics, Electrical and Electronic Engineering
Subjects:Technology > Electrical engineering. Electronics Nuclear engineering
Department:Faculty of Engineering > Electronic and Electrical Engineering
Depositing user: Strathprints Administrator
Date deposited:04 Nov 2008
Last modified:20 Sep 2019 02:16
URI:https://strathprints.strath.ac.uk/id/eprint/7100
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