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Micromachining of a piezocomposite transducer using a copper vapour laser

Farlow, R. and Galbraith, W. and Knowles, M. and Hayward, G. (2001) Micromachining of a piezocomposite transducer using a copper vapour laser. IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control, 48 (3). pp. 639-640. ISSN 0885-3010

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Abstract

A 1-3 piezocomposite transducer with front face dimensions of 2×2 mm has been micromachined using a copper vapor laser. The device consists of PZT5A piezoceramic pillars with a 65-μm pitch suspended in a low viscosity thermosetting polymer. The kerf width is 13 μm, and the transducer thickness is 170 μm, making the device suitable for ultrasonic reception at frequencies close to 10 MHz.