A low cost patternable packaging technology for biosensors

Buchoux, Anthony and Blair, Ewen O. and Tsiamis, Andreas and Marland, Jamie R.K. and Smith, Stewart (2017) A low cost patternable packaging technology for biosensors. In: 2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017. IEEE, Piscataway, NJ. ISBN 9781538629529

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    Abstract

    This paper demonstrates a simple and low cost technology to reliably and accurately package integrated chips. Microchannels and cavities of minimum feature size of 500 μm can be reliably reproduced. In addition, the curing depth in relation to the exposure time was investigated. A simple microfluidic device, consisting of a 500 μm channel and 2 mm ports, was manufactured to demonstrate the possibilities of this technology. Extensive electrochemical experiments showed that the packaging material is a good insulator and leaves no residue on the chip.

    Author(s):Buchoux, Anthony, Blair, Ewen O. ORCID logoORCID: https://orcid.org/0000-0002-1887-8001, Tsiamis, Andreas, Marland, Jamie R.K. and Smith, Stewart
    Item type:Book Section
    ID code:66098
    Keywords:biosensors, electrochemistry, packaging, Electrical engineering. Electronics Nuclear engineering, Electrical and Electronic Engineering, Biomedical Engineering
    Subjects:Technology > Electrical engineering. Electronics Nuclear engineering
    Department:Faculty of Engineering > Biomedical Engineering
    Depositing user: Pure Administrator
    Date deposited:14 Nov 2018 10:08
    Last modified:29 Aug 2019 11:42
    Related URLs:
    URI:https://strathprints.strath.ac.uk/id/eprint/66098
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