Pulse plating of copper from deep eutectic solvents

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Green, Todd and Su, Xiaomeng and Roy, Sudipta (2017) Pulse plating of copper from deep eutectic solvents. ECS Transactions, 77 (11). pp. 1247-1253. ISSN 1938-6737 (https://doi.org/10.1149/07711.1247ecst)

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Abstract

The effect of pulse parameters on the deposition of copper from a chloride-based deep eutectic solvent (DES) was investigated. While satisfactory deposits could be obtained for some pulse conditions, at small duty cycles or long off-times the current efficiencies obtained were very low. These findings were consistent with a corrosion process occurring during the off-time, most likely the comproportionation reaction: Cu + CuIICl4 2- → 2CuICl2 - . Initial experimental results were consistent with the corrosion rate being controlled by the transport of the CuIICl4 2- species to the electrode surface. With this assumption, a simple corrosion model was developed to account for the observed loss in current efficiency as a function of the pulse conditions. While this model broadly predicts the observed results some discrepancy between the observed and measured were noted.

ORCID iDs

Green, Todd ORCID logoORCID: https://orcid.org/0000-0002-3538-5217, Su, Xiaomeng ORCID logoORCID: https://orcid.org/0000-0001-8602-3366 and Roy, Sudipta ORCID logoORCID: https://orcid.org/0000-0002-3399-035X;
CORE (COnnecting REpositories)