Pulse plating of copper from deep eutectic solvents

Green, Todd and Su, Xiaomeng and Roy, Sudipta (2017) Pulse plating of copper from deep eutectic solvents. ECS Transactions, 77 (11). pp. 1247-1253. ISSN 1938-6737 (https://doi.org/10.1149/07711.1247ecst)

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Abstract

The effect of pulse parameters on the deposition of copper from a chloride-based deep eutectic solvent (DES) was investigated. While satisfactory deposits could be obtained for some pulse conditions, at small duty cycles or long off-times the current efficiencies obtained were very low. These findings were consistent with a corrosion process occurring during the off-time, most likely the comproportionation reaction: Cu + CuIICl4 2- → 2CuICl2 - . Initial experimental results were consistent with the corrosion rate being controlled by the transport of the CuIICl4 2- species to the electrode surface. With this assumption, a simple corrosion model was developed to account for the observed loss in current efficiency as a function of the pulse conditions. While this model broadly predicts the observed results some discrepancy between the observed and measured were noted.

ORCID iDs

Green, Todd ORCID logoORCID: https://orcid.org/0000-0002-3538-5217, Su, Xiaomeng ORCID logoORCID: https://orcid.org/0000-0001-8602-3366 and Roy, Sudipta ORCID logoORCID: https://orcid.org/0000-0002-3399-035X;
CORE (COnnecting REpositories)