Copper electrodeposition from a water-containing choline chloride based deep eutectic solvent

Valverde, Priscila and Green, Todd and Roy, Sudipta (2017) Copper electrodeposition from a water-containing choline chloride based deep eutectic solvent. ECS Transactions, 77 (11). pp. 859-864. ISSN 1938-6737 (https://doi.org/10.1149/07711.0859ecst)

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Abstract

This study investigated the effect of water on the physical and electrochemical properties of a choline chloride deep eutectic solvent (DES). Physical and electrochemical measurements were performed on the DES containing varying amounts of water. When the water content was increased from 1% to 15 wt%, the viscosity and density declined while the conductivity increased significantly. Similarly, the limiting current for Cu reduction at 15 wt% of water was also found to be three times greater than the limiting current at 1 wt% of water. This latter effect could be mostly attributed to viscosity changes, but there was evidence of deviations from ideal Stokes-Einstein behaviour. These experimental results show that inclusion of water facilitates ion mobility, and generally results in improved electrochemical characteristics.

ORCID iDs

Valverde, Priscila ORCID logoORCID: https://orcid.org/0000-0002-7211-1127, Green, Todd ORCID logoORCID: https://orcid.org/0000-0002-3538-5217 and Roy, Sudipta ORCID logoORCID: https://orcid.org/0000-0002-3399-035X;
CORE (COnnecting REpositories)