Microstructural characteristics of electrodeposited damascene copper lines

Konkova, T.N. and Mironov, S. Yu and Ke, Y. and Ohnuki, J. (2014) Microstructural characteristics of electrodeposited damascene copper lines. Letters on Materials, 4 (2). pp. 104-107. ISSN 2410-3535

[img]
Preview
Text (Konkova-LM2014-Microstructural-characteristics-of-electrodeposited-damascene-copper-lines)
Konkova_LM2014_Microstructural_characteristics_of_electrodeposited_damascene_copper_lines.pdf
Final Published Version
License: Creative Commons Attribution 4.0 logo

Download (1MB)| Preview

    Abstract

    The high-resolution electron backscatter diffraction technique and transmission electron microscopy were applied to study microstructure in the overburden layer, in upper and bottom parts of as-deposited as well as subsequently annealed nanoscale (100 nm width) copper wires. It was shown that the temperature interval 100oC-200oC should be seen as a transition period of microstructure evolution in damascene copper lines.