Microstructural characteristics of electrodeposited damascene copper lines

Konkova, T.N. and Mironov, S. Yu and Ke, Y. and Ohnuki, J. (2014) Microstructural characteristics of electrodeposited damascene copper lines. Letters on Materials, 4 (2). pp. 104-107. ISSN 2410-3535 (https://doi.org/10.22226/2410-3535-2014-2-104-107)

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Abstract

The high-resolution electron backscatter diffraction technique and transmission electron microscopy were applied to study microstructure in the overburden layer, in upper and bottom parts of as-deposited as well as subsequently annealed nanoscale (100 nm width) copper wires. It was shown that the temperature interval 100oC-200oC should be seen as a transition period of microstructure evolution in damascene copper lines.

ORCID iDs

Konkova, T.N. ORCID logoORCID: https://orcid.org/0000-0001-7495-7495, Mironov, S. Yu, Ke, Y. and Ohnuki, J.;
CORE (COnnecting REpositories)