Use of dielectric spectroscopy to assess adhesively bonded composite structures, Part II: Dielectric study

Boinard, P. and Banks, W.M. and Pethrick, R.A. (2002) Use of dielectric spectroscopy to assess adhesively bonded composite structures, Part II: Dielectric study. Journal of Adhesion, 78 (12). pp. 1015-1026. ISSN 0021-8464 (http://dx.doi.org/10.1080/00218460215042)

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Abstract

A study of the sorption and desorption of moisture in a structural adhesively bonded composite structure using low- and high-frequency dielectric spectroscopy is reported when the adhesive is subjected to a hot and wet environment. As water penetrates the structure, variations in the dielectric permittivity and dielectric loss can be used to understand the nature of the absorption process. A new dielectric tool is introduced to aid interpretation of the dielectric data based on the Kirkwood-Fröhlich equation of the dipolar activity. The data are correlated with gravimetric and dynamic mechanical thermal analysis of the adhesive during exposure to moisture reported in Part I of this series of three articles.

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