Investigation on the thermal effects during nanometric cutting process while using nanoscale diamond tools

Tong, Zhen and Liang, Yingchun and Yang, Xuechun and Luo, Xichun (2014) Investigation on the thermal effects during nanometric cutting process while using nanoscale diamond tools. International Journal of Advanced Manufacturing Technology, 74 (9-12). pp. 1709-1718. ISSN 1433-3015 (https://doi.org/10.1007/s00170-014-6087-x)

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Abstract

In this paper, large scale molecular dynamics simulations are carried out to investigate the thermal effect on nanometric cutting of copper while using a single tip and a multi-tip nanoscale diamond tool. A new concept of atomistic equivalent temperature is proposed and used to characterize the temperature distribution in the cutting zone. The results show that the cutting heat generated while using a multi-tip tool is larger than that of using a single tip tool. The local temperature is found to be higher at the inner sides of the multi-tip tool cutting edges than the outer sides. Applying centro-symmetry parameters and radius distribution function, the local annealing process and its effect on the integrity of the machined nanostructures are analyzed. It is observed that the local annealing at the machined surface can improve the surface integrity of the machined nanostructures, especially in the multi-tip diamond tool cutting process. There exists a great potential to control the thickness of residual atomic defect layer through an optimal selection of the cutting speed with designed depth of cut.

ORCID iDs

Tong, Zhen, Liang, Yingchun, Yang, Xuechun and Luo, Xichun ORCID logoORCID: https://orcid.org/0000-0002-5024-7058;