PARAMOD metallization of circuit traces and microvias in photodefined dielectrics : Organic High Density Interconnect Structures (HDIS)
Kydd, P. H. and Jablonski, G. A. and Richard, D. L. and Gleskova, Helena; (1997) PARAMOD metallization of circuit traces and microvias in photodefined dielectrics : Organic High Density Interconnect Structures (HDIS). In: Organic High Density Interconnect Structures (HDIS). Institute for Interconnecting and Packaging Electronic Circuits, pp. 174-180. ISBN 9781580985239
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This paper explores PARAMOD metallization of circuit traces and microvias in photodefined dielectrics.
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Item type: Book Section ID code: 47490 Dates: DateEvent21 November 1997PublishedNotes: M1 - Conference contribution Subjects: UNSPECIFIED Department: Faculty of Engineering > Electronic and Electrical Engineering Depositing user: Pure Administrator Date deposited: 14 Apr 2014 22:28 Last modified: 08 Apr 2024 13:09 Related URLs: URI: https://strathprints.strath.ac.uk/id/eprint/47490
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