Amorphous silicon thin-film transistors on compliant polyimide foil substrates
Gleskova, Helena and Wagner, Sigurd (1999) Amorphous silicon thin-film transistors on compliant polyimide foil substrates. IEEE Electron Device Letters, 20 (9). pp. 473-475. (https://doi.org/10.1109/55.784456)
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Much of the mechanical strain in semiconductor devices can be relieved when they are made on compliant substrates. We demonstrate this strain relief with amorphous silicon thin-film transistors made on 25-μm thick polyimide foil, which can be bent to radii of curvature R down to 0.5 mm without substantial change in electrical characteristics.
ORCID iDs
Gleskova, Helena ORCID: https://orcid.org/0000-0001-7195-9639 and Wagner, Sigurd;-
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Item type: Article ID code: 33408 Dates: DateEvent1 September 1999PublishedSubjects: Technology > Electrical engineering. Electronics Nuclear engineering Department: Faculty of Engineering > Electronic and Electrical Engineering Depositing user: Pure Administrator Date deposited: 12 Oct 2011 10:14 Last modified: 11 Nov 2024 09:50 Related URLs: URI: https://strathprints.strath.ac.uk/id/eprint/33408
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