Monitoring the solvent uptake in adhesive bonded joints using a novel non-destructive technique by applying high frequency dielectrics

Armstrong, G.S. and Pethrick, R.A. and Banks, W.M. and Crane, R.L.; Mittal, K.L, ed. (2002) Monitoring the solvent uptake in adhesive bonded joints using a novel non-destructive technique by applying high frequency dielectrics. In: Adhesive joints. VSP International Science Publishers. ISBN 9789067643719

Abstract

This chapter looks at monitoring the solvent uptake in adhesive bonded joints using a novel non-destructive technique by applying high frequency dielectrics

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• Item metadata

  Item type:	Book Section
  ID code:	10170
  Dates:	Date Event 1 September 2002 Published
  Notes:	print: 9067643718
  Keywords:	monitoring, solvent uptake, adhesive bonded joints, novel non-destructive technique , high frequency dielectrics, Chemistry
  Subjects:	Science > Chemistry
  Department:	Faculty of Science > Pure and Applied Chemistry Faculty of Engineering > Mechanical and Aerospace Engineering
  Depositing user:	Strathprints Administrator
  Date deposited:	18 Jan 2012 12:47
  Last modified:	15 Sep 2021 15:28
  URI:	https://strathprints.strath.ac.uk/id/eprint/10170