Monitoring the solvent uptake in adhesive bonded joints using a novel non-destructive technique by applying high frequency dielectrics

Armstrong, G.S. and Pethrick, R.A. and Banks, W.M. and Crane, R.L.; Mittal, K.L, ed. (2002) Monitoring the solvent uptake in adhesive bonded joints using a novel non-destructive technique by applying high frequency dielectrics. In: Adhesive joints. VSP International Science Publishers. ISBN 9789067643719

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Abstract

This chapter looks at monitoring the solvent uptake in adhesive bonded joints using a novel non-destructive technique by applying high frequency dielectrics

Creators(s):	Armstrong, G.S., Pethrick, R.A., Banks, W.M. and Crane, R.L.; Mittal, K.L
Item type:	Book Section
ID code:	10170
Notes:	print: 9067643718
Keywords:	monitoring, solvent uptake, adhesive bonded joints, novel non-destructive technique , high frequency dielectrics, Chemistry
Subjects:	Science > Chemistry
Department:	Faculty of Science > Pure and Applied Chemistry Faculty of Engineering > Mechanical and Aerospace Engineering
Depositing user:	Strathprints Administrator
Date deposited:	18 Jan 2012 12:47
Last modified:	16 Jun 2020 10:28
URI:	https://strathprints.strath.ac.uk/id/eprint/10170
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