Monitoring the solvent uptake in adhesive bonded joints using a novel non-destructive technique by applying high frequency dielectrics

Armstrong, G.S. and Pethrick, R.A. and Banks, W.M. and Crane, R.L.; Mittal, K.L, ed. (2002) Monitoring the solvent uptake in adhesive bonded joints using a novel non-destructive technique by applying high frequency dielectrics. In: Adhesive joints. VSP International Science Publishers. ISBN 9789067643719

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Abstract

This chapter looks at monitoring the solvent uptake in adhesive bonded joints using a novel non-destructive technique by applying high frequency dielectrics