Monitoring the solvent uptake in adhesive bonded joints using a novel non-destructive technique by applying high frequency dielectrics
Armstrong, G.S. and Pethrick, R.A. and Banks, W.M. and Crane, R.L.; Mittal, K.L, ed. (2002) Monitoring the solvent uptake in adhesive bonded joints using a novel non-destructive technique by applying high frequency dielectrics. In: Adhesive joints. VSP International Science Publishers. ISBN 9789067643719
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This chapter looks at monitoring the solvent uptake in adhesive bonded joints using a novel non-destructive technique by applying high frequency dielectrics
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Item type: Book Section ID code: 10170 Dates: DateEvent1 September 2002PublishedNotes: print: 9067643718 Subjects: Science > Chemistry Department: Faculty of Science > Pure and Applied Chemistry
Faculty of Engineering > Mechanical and Aerospace EngineeringDepositing user: Strathprints Administrator Date deposited: 18 Jan 2012 12:47 Last modified: 11 Nov 2024 14:35 URI: https://strathprints.strath.ac.uk/id/eprint/10170
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