Advanced transfer printing with in-situ optical monitoring for the integration of micron-scale devices

Guilhabert, Benoit and Bommer, Sean P. and Wessling, Nils K. and Jevtics, Dimitars and Smith, Jack A. and Xia, Zhongyi and Ghosh, Saptarsi and Kappers, Menno and Watson, Ian M. and Oliver, Rachel A. and Dawson, Martin D. and Strain, Michael J. (2023) Advanced transfer printing with in-situ optical monitoring for the integration of micron-scale devices. IEEE Journal of Selected Topics in Quantum Electronics, 29 (3). pp. 1-11. 7900111. ISSN 1077-260X (https://doi.org/10.1109/jstqe.2022.3227340)

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Abstract

Transfer printing integration of planar membrane devices on photonic and electronic circuits is becoming a well established technology. Typical systems incorporate a single planar layer printed into full contact with the host substrate. In this work we present an advanced transfer print system that enables printing of optical devices in non-planar geometries and allows in-situ optical monitoring of devices. We show micro-resonators with air-clad whispering gallery modes coupled to on-chip waveguides, inverted device printing and three dimensionally assembled micro-cavities incorporating semiconductor micro-lenses and nanowire lasers. We demonstrate printing onto non-standard substrates including optical chip facets and single-mode fibre ends. The optical fibre printing was carried out with alignment assistance from in-situ optical coupling through the transfer printing system in real-time allowing active alignment of the system.

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