Spatially dense integration of micron-scale devices from multiple materials on a single chip via transfer-printing

Jevtics, Dimitars and Smith, Jack A. and McPhillimy, John and Guilhabert, Benoit and Hill, Paul and Klitis, Charalambos and Hurtado, Antonio and Sorel, Marc and Tan, Hark Hoe and Jagadish, Chennupati and Dawson, Martin D. and Strain, Michael J. (2021) Spatially dense integration of micron-scale devices from multiple materials on a single chip via transfer-printing. Optical Materials Express, 11 (10). pp. 3567-3576. ISSN 2159-3930 (

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The heterogeneous integration of devices from multiple material platforms onto a single chip is demonstrated using a transfer-printing (TP) technique. Serial printing of devices in spatially dense arrangements requires that subsequent processes do not disturb previously printed components, even in the case where the print head is in contact with those devices. In this manuscript we show the deterministic integration of components within a footprint of the order of the device size, including AlGaAs, diamond and GaN waveguide resonators integrated onto a single chip. Serial integration of semiconductor nanowire (NW) using GaAs/AlGaAs and InP lasers is also demonstrated with device to device spacing in the 1 μm range.


Jevtics, Dimitars ORCID logoORCID:, Smith, Jack A., McPhillimy, John ORCID logoORCID:, Guilhabert, Benoit ORCID logoORCID:, Hill, Paul ORCID logoORCID:, Klitis, Charalambos, Hurtado, Antonio ORCID logoORCID:, Sorel, Marc, Tan, Hark Hoe, Jagadish, Chennupati, Dawson, Martin D. ORCID logoORCID: and Strain, Michael J. ORCID logoORCID:;