Low temperature methane conversion with perovskite-supported exo/endo-particles

Kousi, Kalliopi and Neagu, Dragos and Bekris, Leonidas and Calì, Eleonora and Kerherve, Gwilherm and Papaioannou, Evangelos I. and Payne, David J. and Metcalfe, Ian S. (2020) Low temperature methane conversion with perovskite-supported exo/endo-particles. Journal of Materials Chemistry. A, 8 (25). pp. 12406-12417. ISSN 2050-7488

[thumbnail of Kousi-etal-JMCA-2020-Low-temperature-methane-conversion-with-perovskite-supported-exo-endo-particles]
Preview
Text (Kousi-etal-JMCA-2020-Low-temperature-methane-conversion-with-perovskite-supported-exo-endo-particles)
Kousi_etal_JMCA_2020_Low_temperature_methane_conversion_with_perovskite_supported_exo_endo_particles.pdf
Final Published Version
License: Creative Commons Attribution-NonCommercial 4.0 logo

Download (1MB)| Preview

    Abstract

    Lowering the temperature at which CH4 is converted to useful products has been long-sought in energy conversion applications. Selective conversion to syngas is additionally desirable. Generally, most of the current CH4 activation processes operate at temperatures between 600 and 900 °C when non-noble metal systems are used. These temperatures can be even higher for redox processes where a gas phase–solid reaction must occur. Here we employ the endogenous-exsolution concept to create a perovskite oxide with surface and embedded metal nanoparticles able to activate methane at temperatures as low as 450 °C in a cyclic redox process. We achieve this by using a non-noble, Co–Ni-based system with tailored nano- and micro-structure. The materials designed and prepared in this study demonstrate long-term stability and resistance to deactivation mechanisms while still being selective when applied for chemical looping partial oxidation of methane.

    ORCID iDs

    Kousi, Kalliopi, Neagu, Dragos ORCID logoORCID: https://orcid.org/0000-0001-7208-1055, Bekris, Leonidas, Calì, Eleonora, Kerherve, Gwilherm, Papaioannou, Evangelos I., Payne, David J. and Metcalfe, Ian S.;